Saturday, January 20, 2018
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Oriented strand board, also known as OSB, waferboard, is an engineered wood product formed by layering strands (flakes) of wood in specific orientations. In appearance, it may have a rough and variegated surface with the individual strips (around 2.5 by 15 cm (approx. 1 inch x 6 inches) each lying unevenly across each other. Strands or wafers are bonded together under heat and pressure using a waterproof phenolic resin adhesive or equivalent waterproof binder.

OSB has efficient additions to the wood building materials as it:

  • Raw materials which are often used are from trees which are small in diameter, crooked or warped which in many cases have a very low commercial value, so by using this one can efficiently utilizing the forest.
  • A consistent strength can be obtained throughout the panel during manufacturing by removing many strength reducing defects and dispersing the remaining defects evenly through the rest of the panel.
  • The increase in panel strength along the long panel dimension may also be obtained by the orientation of strands during the manufacturing process


Some specialty products are made for:

  • Siding
  • rim boards
  • stair treads
  • concrete formwork
  • treated or foil-faced sheathing

General Properties of OSB

  • Main available thicknesses 8, 9, 10, 11, 12, 15, 18, 22
  • Main available Size: 2440*1220, 2500*1250, 5000*2500
  • By request OSB is available in thickness from 6mm-40mm in additional sizes.

Physical and mechanical characteristics Standard Specification
formaldehyde content EN 120 in conformity with E1 (8 mg/100g) and the ordinance on the prohibition of chemicals
Combustibility (classification) DIN 4102 T1 B 2 (normal incendiary)
Density DIN 52 361 600 kg/m3
Moisture content EN 322 9 +– 3 %
Swelling in thickness (mean value) DIN 52 364 ≤10 %
Thickness tolerance EN 300 +– 0,8 mm unsanded surface
+– 0,3 mm sanded surface
Tolerance of length and width EN 300 +– 3 mm
Squareness (Diagonal Difference) EN 300 2 mm for each 1000 mm in length
Thermal conductivity DIN 4108 T2 0.13 W/m K
Dimensional change length/width change of relative humidity from 30 to 85 % at 20 °C 0.30 %
Vapour diffusion resistance factor DIN 52615 15 mm 18 mm 22 mm
µ-factor 190/270 160/220 300/380
sD value (m) 2.8/4.0 2.7/3.8 6.3/8.2
Binders/glue surface layer modified melamine resin
core layer formaldehyde-free with PUR